臺灣產(chǎn)千住錫膏
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產(chǎn)品名稱:
臺灣產(chǎn)千住錫膏
產(chǎn)品型號:
M705-S101HF-S4
產(chǎn)品展商:
千住金屬
產(chǎn)品文檔:
無相關(guān)文檔
簡單介紹
錫96.5、銀3.0、銅0.5###熔點:217-220℃###190±20Pa.s###230-260℃###要求無鹵素的復雜電子產(chǎn)品制造###0-10℃
臺灣產(chǎn)千住錫膏
的詳細介紹
臺灣產(chǎn)千住錫膏
臺灣產(chǎn)千住錫膏 ECO SOLDER PASTE M705-S101HF-S4
1.Scope
This specification covers the solder paste,
ECO SOLDER PASTE M705-S101-S4, using lead-free solder alloy, used for
wiring connection and so on, of electrical and electronic parts.
2.Standard
２.1Chemical composition of solder alloy（Test method：STM-9）
Composition and impurities are prescribed as following tables
|
Composition ( mass% )
|
|
Ａｇ
|
Ｃｕ
|
Ｓｎ
|
|
3.0 ± 0.1
|
0.50 ± 0.05
|
Balance
|
2.2Performance and standard
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Items
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Performance Standard
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Test Method
|
|
Appearance
|
It shall not have separated flux,and shall be in a smooth pastestate.
|
STM-1
|
|
Flux content (mass%)
|
11.5 ± 1.0
|
STM-5
|
|
Viscosity of solderpaste (Pa s)
|
190 ± 30
|
STM-7-8
|
|
Grain size of powder
（um）
|
36 ～25
|
STM-12-4
|
|
Copper plate corrosion test
|
Shall be passed
|
STM-28-1
|
|
Insulation resistance
|
Ordinary state 1 × 10 or more After humidifying 1 × 10 or more
|
STM-30-8
|
|
Solution resistance
|
100 or more
|
STM-32
|
|
Reflow property
|
No unmelted solder nor black product shall be permissibl
|
STM-34
|
