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美國AMTECH助焊膏
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RMA-223-uv/NC-559-asm
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美國AMTECH助焊膏(NC-559-ASM和RMA-223-UV)二.產(chǎn)品介紹:美國AMTECH研發(fā)了兩種使用于手機(jī)PCB，BGA及PGA等SMD之返修助焊膏，它使用于低離子性之活化劑系統(tǒng)，潤錫速度快，冒煙程度很低，殘留物固化后之表面絕緣阻抗值很高，因此，對手機(jī)等通訊產(chǎn)品之電性干擾非常小.
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AMTECH助焊膏
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RMA-223-UV
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AMTECH助焊膏(NC-559和RMA-223)二.產(chǎn)品介紹:美國AMTECH研發(fā)了兩種使用于手機(jī)PCB，BGA及PGA等SMD之返修助焊膏，它使用于低離子性之活化劑系統(tǒng)，潤錫速度快，冒煙程度很低，殘留物固化后之表面絕緣阻抗值很高，因此，對手機(jī)等通訊產(chǎn)品之電性干擾非常小.
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無鹵助焊膏
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NC-669-LF
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無鹵助焊膏NC-669-LF is an RoHS-compliant lead-free, no-clean solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold)
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水洗助焊膏
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LF-4300-TF
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水洗助焊膏LF-4300-TFThe LF-4300-TF is a medium viscosity water-washable, no-clean flux designed for tin-lead and lead-free alloys. LF-4300-TF is ideal for BGA
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AMTECH水洗無鉛錫膏
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LF-4300
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AMTECH水洗無鉛錫膏Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it.
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AMTECH水洗錫膏
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NWS-4200
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AMTECH水洗錫膏All AMTECH solder pastes conform to ANSI/J-STD-006 and are available for immediate delivery in jars, cartridges, syringes and ProFlow Cassettes.
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AMTECH無鉛錫膏
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WS4900
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AMTECH無鉛錫膏Solder Paste formulae designed for today’s Surface Mount Technologies. All AMTECH solder pastes are available for immediate delivery in jars
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水洗有鉛錫膏
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4300
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水洗有鉛錫膏
一.產(chǎn)品特點(diǎn)
1.采用合成助焊膏
2.有著長時間的模板印刷壽命
3.寬的工藝窗口
4.對大多數(shù)電路板都擁有優(yōu)良的潤濕性和優(yōu)異的兼容性
5.有效的抑制BGA的空洞，且沒有錫珠和立碑
6. 助焊劑殘留物清晰，符合SIR根據(jù)IPC-TM-650.2.6.33的要求
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AMTECH助焊筆
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AMTECH FLUX-RIGHTER
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AMTECH助焊筆All AMTECH liquid fluxes are available in Flux-Righters, a unique tool for rework and touch-up soldering.
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